The high-density, ceramic-based Thermal Compound

Arctic Silver - Premium High Density Thermal Compound - Ceramique - 2,7 grammes


The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

Made with micronized aluminum oxide, boron nitride and zinc oxide.

Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer.

This exclusive combination provides performance exceeding most metal based compounds.


Average particle size: 0.38 microns
(67 particles lined up in a row equal 1/1000th of an inch.)

During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability.

Electrical Insulator.
Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.

Wide Temperature Limits.
Peak: – 40°C to >180°C
Long-Term: – 40°C to 140°C

Easy Clean Up.
Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions.


Important Reminder:
Due to the unique shapes and sizes of the particles in Ceramique, it will take a minimum of 12 hours to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this "break-in" period.